Summary
Overview
Work History
Education
Skills
Timeline
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AHMAD ADIB

AHMAD ADIB

Sr Engineer
Simpang Ampat,Pulau Pinang

Summary

Accomplished Engineer with a proven track record at Teradyne and Intel, enhancing process efficiency and product quality through expert electronic troubleshooting and innovative test methodologies. Recognized for exceptional problem-solving skills and a strong proficiency in solving test hole issues and teamwork, significantly reducing issue resolution times and driving continuous improvement.

Overview

10
10
years of professional experience

Work History

Test Engineer

Teradyne
Bukit Minyak, Pulau Pinang
02.2024 - Current

1. Proactive participate in the internal audit for process continous improvement in CM factory from assembly to backend

2. Acquired electronic troubleshooting technique for analog and digital system and tools certification. (Mixed Signal Osscilioscope, DC Power Supply). Zener Diode, BJT, MOSFET, Feedback Loop, Amplifier, I2C (Clock ans data)

3. Driving for part validation & qualification in Ultraflex tester (Test System Optimized for High-Performance Digital and SoC) for Teradyne Project. Test Visit at Supplier Manufacturer for auditing test methodology.

4. Debugging digital boards to reduce debug board inventory to support for shipment and PIP. Ohming, voltage measure, test fundamental, clock subsystem, power subsystem, channel, frequency oscilloscope, Ztool,IGXL, NXT6 Noise Analyser.

5. Screened and identified top-tier talent for diverse roles, enhancing the company's workforce quality.

6. Skilled at swiftly resolving drive burn-in issues, specializing in diagnosing backplane challenges using MBPS methodology. Known for shortening issue resolution times from 2 months to just 2 weeks and rootcausing tester trip issues due to CDU sensor.

7. Solving issues on new capability tester (new system) related to test program to ensure project continousity

Product Development Engineer

Intel Technology Sdn Bhd
Kulim, Kedah
08.2014 - 01.2024

1. Leading socket elimination project testing for yield (BEY) improvement

2. Responsible to release multiple test program of dif. product for DPM, yield and TTR improvement.

3. Innovating parametric testing solution to detect defect for customer excursion by enabling parametric at cold temperature in hot testing operation.

4. As a problem solver of high impact project (cost efficiency) on the test program to make new operation able to digest data from system platform thus able to increase intel revenue by salvaging the units that are shippable to customers with quality. (3 months to 3 weeks)

5. Lead structural based functional testing team by consulting and driving test hole closure activities.

6. Recognized as passion, accoutability and teamwork engineer by solving customer defect issues

7.Pioneer for test program team development in the organization for server segment - bring the capability to local site

8. Pioneer and lead SBFT debug team at the factory for DPM reduction (socket elimination)

Education

Bachelor Of Electrical - Microelectronic

Universiti Teknologi Malaysia
Skudai, Johor
08.2014

A-Level - Sains Hayat

Universiti Malaya
Kuala Lumpur
06.2010

Skills

1 TPIE

Timeline

Test Engineer

Teradyne
02.2024 - Current

Product Development Engineer

Intel Technology Sdn Bhd
08.2014 - 01.2024

Bachelor Of Electrical - Microelectronic

Universiti Teknologi Malaysia

A-Level - Sains Hayat

Universiti Malaya
AHMAD ADIBSr Engineer